Other Function Logic ICs

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Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Schmitt Trigger Surface Mount No. of Functions Maximum Frequency At Nominal Supply Technology Screening Level No. of Inputs No. of Bits Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Count Direction Output Characteristics Trigger Type Minimum Operating Temperature Terminal Finish Terminal Position Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

74LVC1G57GS,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

24 Amp

Gates

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

1

5.5 V

.35 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1 mm

LVC/LCX/Z

SN74LS297N

Texas Instruments

LOGIC CIRCUIT

COMMERCIAL

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

TTL

1

TUBE

5

IN-LINE

35 ns

24 Amp

2.54 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T16

5.25 V

5.08 mm

7.62 mm

Not Qualified

4.75 V

55 mA

e4

19.305 mm

LS

74LVC1G57GV-Q100H

Nexperia

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

TR, 7 INCH

1.8

SMALL OUTLINE, THIN PROFILE

.95 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

30

260

2.9 mm

LVC/LCX/Z

74LVC1G57DW-7

Diodes Incorporated

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

3.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

MC14490PG

Onsemi

LOGIC CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

6

CMOS

4

5

5/15

IN-LINE

DIP16,.3

740 ns

Other Logic ICs

2.54 mm

125 Cel

RIGHT

POSITIVE EDGE

-55 Cel

Tin (Sn)

DUAL

4.5 MHz

R-PDIP-T16

18 V

4.44 mm

7.62 mm

Not Qualified

TRUE

3 V

e3

40

260

19.175 mm

4000/14000/40000

SN74LVC1G57DBVRG4

Texas Instruments

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

24 Amp

Gates

.95 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

5.5 V

1.45 mm

1.6 mm

Not Qualified

1.65 V

e4

30

260

2.9 mm

LVC/LCX/Z

GTL2000DGG,118

NXP Semiconductors

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

MOS

TR, 13 INCH

2.5,3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.3,20

Other Logic ICs

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G48

1

Not Qualified

30

260

SN74AUP1G97DCKRG4

Texas Instruments

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

1.7 Amp

Logic IC:Other

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

.8 V

e4

30

260

2 mm

AUP/ULP/V

MAX6818EAP

Maxim Integrated

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

BICMOS

5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

.65 mm

125 Cel

3-STATE

-40 Cel

TIN LEAD

DUAL

R-PDSO-G20

1

5.5 V

1.99 mm

5.29 mm

Not Qualified

TRUE

2.7 V

e0

20

240

7.2 mm

6818

MAX6818EAP+

Analog Devices

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3/5

SMALL OUTLINE, SHRINK PITCH

SSOP20,.3

Other Logic ICs

.65 mm

125 Cel

3-STATE

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G20

1

5.5 V

1.99 mm

5.29 mm

Not Qualified

2.7 V

e3

30

260

7.2 mm

NL7SZ98DFT2G

Onsemi

LOGIC CIRCUIT

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

7

CMOS

TR

2.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

AUP/ULP/V

74LVC1G57GM,115

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N6

1

5.5 V

.5 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1.45 mm

LVC/LCX/Z

AS5311-ATST

Ams Ag

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP20,.25

Other Logic ICs

.635 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-G20

3

Not Qualified

21 mA

e3

260

SE555

Semiconductors

HMC744LC3

Analog Devices

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

GOLD OVER NICKEL

QUAD

S-CQCC-N16

3

3.6 V

.92 mm

3 mm

3 V

e4

30

260

3 mm

744

HMC744LC3TR

Analog Devices

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

CERAMIC, METAL-SEALED COFIRED

YES

1

TR

3.3

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Clock Drivers

.5 mm

85 Cel

-40 Cel

QUAD

S-CQCC-N16

3

3.6 V

.92 mm

3 mm

Not Qualified

3 V

30

260

3 mm

744

SN74AUP1G97DCKRE4

Texas Instruments

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

4 Amp

Logic IC:Other

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

TRUE

.8 V

e4

30

260

2 mm

AUP/ULP/V

74LVC1G57GM,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

24 Amp

Gates

.5 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N6

1

5.5 V

.5 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1.45 mm

LVC/LCX/Z

SN74LS628D

Texas Instruments

LOGIC CIRCUIT

COMMERCIAL

GULL WING

14

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TTL

1

TUBE

5

SMALL OUTLINE

15 ns

24 Amp

1.27 mm

70 Cel

0 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G14

1

5.25 V

1.75 mm

3.9 mm

Not Qualified

COMPLEMENTARY

4.75 V

55 mA

e4

30

260

8.65 mm

LS

MC14490DWR2G

Onsemi

LOGIC CIRCUIT

MILITARY

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

6

CMOS

4

5

5/15

SMALL OUTLINE

SOP16,.4

740 ns

Other Logic ICs

1.27 mm

125 Cel

RIGHT

-55 Cel

MATTE TIN

DUAL

4.5 MHz

R-PDSO-G16

3

18 V

2.65 mm

7.5 mm

Not Qualified

TRUE

3 V

e3

30

260

10.3 mm

4000/14000/40000

74LVC1G58DW-7

Diodes Incorporated

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

3.3

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

NL7SZ57DFT2G-L22348

Onsemi

LOGIC CIRCUIT

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TR

2.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

.65 mm

125 Cel

-55 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

2 mm

LVC/LCX/Z

NL7SZ58DFT2G

Onsemi

LOGIC CIRCUIT

MILITARY

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

24 Amp

Gates

.65 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.25 mm

Not Qualified

1.65 V

e3

30

260

2 mm

LVC/LCX/Z

SN74LVC1G97DSFR

Texas Instruments

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

3

TR

3.3

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

16.4 ns

32 Amp

Gates

.35 mm

125 Cel

-40 Cel

Nickel/Palladium/Gold (Ni/Pd/Au)

DUAL

S-PDSO-N6

1

5.5 V

.4 mm

1 mm

Not Qualified

1.65 V

.01 mA

e4

NOT SPECIFIED

260

1 mm

LVC/LCX/Z

TPIC6B259DWRG4

Texas Instruments

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TR

5

SMALL OUTLINE

1.27 mm

125 Cel

OPEN-DRAIN

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G20

1

5.5 V

2.65 mm

7.5 mm

Not Qualified

INVERTED

4.5 V

e4

30

260

12.8 mm

6B

HCF4048BEY

STMicroelectronics

LOGIC CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

NO

1

CMOS

TUBE

5

5/15

50 pF

IN-LINE

DIP16,.3

Gates

2.54 mm

125 Cel

3-STATE

-55 Cel

Matte Tin (Sn)

DUAL

R-PDIP-T16

20 V

5.1 mm

7.62 mm

Not Qualified

3 V

CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE

e3

4000/14000/40000

MAX6817EUT/GH9-T

Maxim Integrated

LOGIC CIRCUIT

1

74LVC1G97GN,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

1.8

3.3

50 pF

SMALL OUTLINE

SOLCC6,.04,12

24 Amp

Gates

.3 mm

125 Cel

-40 Cel

TIN

DUAL

R-PDSO-N6

1

5.5 V

.35 mm

.9 mm

Not Qualified

1.65 V

e3

30

260

1 mm

LVC/LCX/Z

74LVC1G57GW,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

125 Cel

-40 Cel

DUAL

R-PDSO-G6

5.5 V

1.1 mm

1.25 mm

1.65 V

2 mm

LVC/LCX/Z

74LVC1G97W6-7

Diodes Incorporated

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

3.3

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

24 Amp

Gates

.95 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.35 mm

1.6 mm

Not Qualified

1.65 V

e3

30

260

2.85 mm

LVC/LCX/Z

74LVC1G57W6-7

Diodes Incorporated

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

3.3

3.3

50 pF

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

TSOP6,.11,37

24 Amp

Gates

.95 mm

125 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.35 mm

1.6 mm

Not Qualified

1.65 V

e3

30

260

2.85 mm

LVC/LCX/Z

NL7SZ57DBVT1G

Onsemi

LOGIC CIRCUIT

MILITARY

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TR

3.3

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

.95 mm

125 Cel

-55 Cel

MATTE TIN

DUAL

R-PDSO-G6

1

5.5 V

1.1 mm

1.5 mm

1.65 V

e3

30

260

3 mm

LVC/LCX/Z

SN74LVC1G97DRLRG4

Texas Instruments

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

FL6,.047,20

24 Amp

Gates

.5 mm

125 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD SILVER

DUAL

R-PDSO-N6

1

5.5 V

.6 mm

1.2 mm

Not Qualified

TRUE

1.65 V

e4

30

260

1.6 mm

LVC/LCX/Z

HMC713LP3ETR

Analog Devices

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

TR

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N16

5.5 V

1 mm

3 mm

2.7 V

NOT SPECIFIED

NOT SPECIFIED

3 mm

713

MAX6817EUT

Maxim Integrated

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

3/5

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

Other Logic ICs

.95 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G6

Not Qualified

MAX6817EUT+

Analog Devices

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

2

BICMOS

5

3/5

SMALL OUTLINE

TSOP6,.11,37

Other Logic ICs

.95 mm

125 Cel

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G6

1

5.5 V

Not Qualified

2.7 V

e3

30

260

6817

NC7SP57P6X

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

.5 Amp

Gates

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

.9 V

e4

30

260

2 mm

P

74AUP1G57GM,115

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.1

1.2/3.3

30 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

1.7 Amp

Gates

.5 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-N6

1

3.6 V

.5 mm

1 mm

Not Qualified

.8 V

e3

30

260

1.45 mm

AUP/ULP/V

74LVC1G97GS,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

24 Amp

Gates

.35 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N6

1

5.5 V

.35 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1 mm

LVC/LCX/Z

SN74AUP1G58DCKTG4

Texas Instruments

LOGIC CIRCUIT

INDUSTRIAL

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.2

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

1.7 Amp

Gates

.65 mm

85 Cel

3-STATE

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G6

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

.8 V

e4

30

260

2 mm

AUP/ULP/V

74AUP1G58GW,125

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

6

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.1

1.2/3.3

30 pF

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP6,.08

1.7 Amp

Gates

.65 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

R-PDSO-G6

1

3.6 V

1.1 mm

1.25 mm

Not Qualified

.8 V

e3

30

260

2 mm

AUP/ULP/V

NBSG86AMNR2G

Onsemi

LOGIC CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

NO

YES

1

ECL

TR

2.5

+-2.5/+-3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.12SQ,20

Gates

.5 mm

85 Cel

-40 Cel

NICKEL GOLD PALLADIUM

QUAD

S-XQCC-N16

1

3.465 V

1 mm

3 mm

Not Qualified

2.375 V

39 mA

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

3 mm

86

CXD3400N

Sony

LOGIC CIRCUIT

COMMERCIAL EXTENDED

GULL WING

20

LSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

.65 mm

75 Cel

3-STATE

-20 Cel

DUAL

R-PDSO-G20

5.5 V

1.45 mm

4.4 mm

Not Qualified

2.7 V

10

260

6.5 mm

74AUP1G57GXZ

Nexperia

LOGIC CIRCUIT

AUTOMOTIVE

BUTT

6

HVBCC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TR, 7 INCH

1.1

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

BOTTOM

R-PBCC-B6

1

3.6 V

.35 mm

.8 mm

.8 V

e4

30

260

1 mm

AUP/ULP/V

CD4048BE

Texas Instruments

LOGIC CIRCUIT

MILITARY

THROUGH-HOLE

16

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

NO

1

CMOS

TUBE

5

5/15

50 pF

IN-LINE

DIP16,.3

6.8 Amp

Gates

2.54 mm

125 Cel

3-STATE

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDIP-T16

18 V

5.08 mm

7.62 mm

Not Qualified

TRUE

3 V

CONFIGURABLE AS NOR/OR/NAND/AND/OR-AND/OR-NAND/AND-NOR; EXPANDABLE

e4

19.305 mm

4000/14000/40000

MAX6818EAP/GG8

Analog Devices

LOGIC CIRCUIT

AUTOMOTIVE

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

8

BICMOS

5

SMALL OUTLINE

125 Cel

3-STATE

-40 Cel

DUAL

R-PDSO-G20

5.5 V

2.7 V

NOT SPECIFIED

NOT SPECIFIED

6818

NLX1G58CMUTCG

Onsemi

LOGIC CIRCUIT

MILITARY

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

5

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

24 Amp

Gates

.35 mm

125 Cel

-55 Cel

NICKEL GOLD PALLADIUM

DUAL

S-PDSO-N6

1

5.5 V

.55 mm

1 mm

Not Qualified

1.65 V

1 mm

1G

74LVC1G57GF,132

NXP Semiconductors

LOGIC CIRCUIT

AUTOMOTIVE

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

TR

1.8

3.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

24 Amp

Gates

.35 mm

125 Cel

-40 Cel

Tin (Sn)

DUAL

S-PDSO-N6

1

5.5 V

.5 mm

1 mm

Not Qualified

1.65 V

e3

30

260

1 mm

LVC/LCX/Z

Other Function Logic ICs

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.