Maxim Integrated Analog-to-Digital Converters 2,400+

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Part	Manufacturer	Converter Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	No. of Analog In Channels	Surface Mount	Maximum Analog Input Voltage	Sample Rate	No. of Functions	Technology	Screening Level	No. of Bits	Maximum Supply Current	Maximum Linearity Error (EL)	Nominal Supply Voltage	Output Bit Code	Power Supplies (V)	Nominal Negative Supply Voltage	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Analog Input Voltage	Output Format	Minimum Operating Temperature	Terminal Finish	Sample and Hold/Track and Hold	Terminal Position	Maximum Conversion Time	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
MX7820UQ/883B	Maxim Integrated	ADC, FLASH METHOD	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5.1 V		1	CMOS		8			5 V	BINARY			IN-LINE			2.54 mm	85 Cel	-.1 V	PARALLEL, 8 BITS	-25 Cel	TIN LEAD	TRACK	DUAL	2 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			24.13 mm
MX7828CQ	Maxim Integrated	ADC, FLASH METHOD	INDUSTRIAL	THROUGH-HOLE	28	DIP		CERAMIC, GLASS-SEALED	8	NO	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY			IN-LINE	DIP28(UNSPEC)			85 Cel	0 V	PARALLEL, 8 BITS	-40 Cel	TIN LEAD	TRACK	DUAL	2.4 us		1			Not Qualified	e0	20	240
MX7821K/D	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	NO LEAD	20	DIE	RECTANGULAR	UNSPECIFIED	1	YES	2.5 V		1	CMOS		8			5 V	BINARY	5,GND/-5	-5 V	UNCASED CHIP	DIE OR CHIP	Analog to Digital Converters		70 Cel	-2.5 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	UPPER	.875 us	R-XUUC-N20	1			Not Qualified	e0
MX674ALCWI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12	10 mA	.012 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	SMALL OUTLINE	SOP28,.4	Analog to Digital Converters	1.27 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL	15 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MAX7129CPL	Maxim Integrated	ADC, DUAL-SLOPE	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	2 V		1	CMOS		4			9 V	BINARY	9		IN-LINE	DIP40,.6	Analog to Digital Converters	2.54 mm	70 Cel	-3 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL		R-PDIP-T40	1	5.08 mm	15.24 mm	Not Qualified	e0			52.075 mm
AD7572KCWG05	Maxim Integrated	A/D CONVERTER	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	BICMOS		12		.024 %		OFFSET BINARY	5,-15		SMALL OUTLINE	SOP24,.4	Analog to Digital Converters	1.27 mm	70 Cel			0 Cel	Tin/Lead (Sn/Pb)		DUAL		R-PDSO-G24				Not Qualified	e0
MX7575JP	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	NO LEAD	20	QCCN	SQUARE	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY			CHIP CARRIER				70 Cel	0 V	SERIAL	0 Cel	TIN LEAD	TRACK	QUAD	15 us	S-PQCC-N20	1			Not Qualified	e0
MX674AKN	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	10 V		1	BICMOS		12	10 mA	.012 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL	15 us	R-PDIP-T28	1	5.08 mm	15.24 mm	Not Qualified	e0			36.83 mm
MX7581KCWI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	8	YES	5 V		1	CMOS		8		.293 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY BINARY	5		SMALL OUTLINE	SOP28,.5	Analog to Digital Converters	1.27 mm	70 Cel	-5 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL		R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e0			17.9 mm
MAX674AUQ	Maxim Integrated
MX7574TQ/883B	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	10 V		1	CMOS	MIL-STD-883	8			5 V	BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY			IN-LINE			2.54 mm	125 Cel	-10 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL		R-GDIP-T18	1	5.08 mm	7.62 mm	Not Qualified	e0
MX7572JEWG12-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	CMOS		12		.012 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY		-15 V	SMALL OUTLINE			1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	5.2 us	R-PDSO-G24	1	2.65 mm	7.5 mm	Not Qualified	e0			15.4 mm
MX7582K/D	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	NO LEAD		DIE	UNSPECIFIED	UNSPECIFIED	4	YES	5 V		1			12			15 V	BINARY		-5 V	UNCASED CHIP				70 Cel	0 V	PARALLEL, WORD	0 Cel	TIN LEAD		UPPER		X-XUUC-N				Not Qualified	e0
MXB7843EUE	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY	2	YES	5.25 V	.125 MHz	1	BICMOS		12		.0488 %	2.7 V	BINARY			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH			.65 mm	85 Cel	0 V	SERIAL	-40 Cel	TIN LEAD	TRACK	DUAL	6 us	R-PDSO-G16	1	1.1 mm	4.4 mm	Not Qualified	e0		245	5 mm
MX674ASQ	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	10 V		1	BICMOS		12		.0244 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	125 Cel	-10 V	PARALLEL, WORD	-55 Cel	TIN LEAD	SAMPLE	DUAL	15 us	R-GDIP-T28	1	5.89 mm	15.24 mm	Not Qualified	e0
DS2450S/T&R	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	4	YES	5.1199 V		1	CMOS		16			5 V	BINARY	5		SMALL OUTLINE	SOP8,.3	Analog to Digital Converters	1.27 mm	85 Cel	2.56 V	SERIAL	-40 Cel	MATTE TIN	SAMPLE	DUAL		R-PDSO-G8		2.13 mm	5.285 mm	Not Qualified	e3			5.31 mm
MX7578BD	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, METAL-SEALED COFIRED	1	NO	5 V		1	CMOS		12			5 V	BINARY	+-5,15	-5 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	85 Cel	0 V	PARALLEL, 8 BITS	-40 Cel	GOLD OVER NICKEL		DUAL	150 us	R-CDIP-T24	1	5.08 mm	7.62 mm	Not Qualified	e4
MX7572JCWG12	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	CMOS		12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	SMALL OUTLINE	SOP24,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	13000000 us	R-PDSO-G24	1	2.65 mm	7.5 mm	Not Qualified	e0			15.4 mm
MX674AJCWI+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12		.0244 %	15 V	BINARY, OFFSET BINARY		-15 V	SMALL OUTLINE			1.27 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel	MATTE TIN	SAMPLE	DUAL	15 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e3			17.9 mm
MX7828KCWI	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	28	SOP		PLASTIC/EPOXY	8	YES	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY			SMALL OUTLINE	SO28(UNSPEC)			70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	Tin/Lead (Sn/Pb)	TRACK	DUAL	2.4 us		1			Not Qualified	e0
MX7820KCWP+	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5.1 V		1	CMOS		8			5 V	BINARY	5		SMALL OUTLINE	SOP20,.4	Analog to Digital Converters	1.27 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	2 us	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	12.8 mm
MX7572JCWG12-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5 V		1	CMOS		12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	SMALL OUTLINE	SOP24,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD		DUAL	13000000 us	R-PDSO-G24		2.65 mm	7.5 mm	Not Qualified	e0			15.4 mm
MX7672KP05	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	2	YES	5 V		1	BICMOS		12		.0244 %	5 V	BINARY	5,-12	-12 V	CHIP CARRIER	LDCC28,.5SQ	Analog to Digital Converters	1.27 mm	70 Cel	-5 V	PARALLEL, WORD	0 Cel	TIN LEAD		QUAD	5.2 us	S-PQCC-J28	1	4.57 mm	11.505 mm	Not Qualified	e0			11.505 mm
MX674AJP+T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	28	HQCCJ	SQUARE	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12		.0244 %	15 V	OFFSET BINARY		-15 V	CHIP CARRIER, HEAT SINK/SLUG			1.27 mm	70 Cel	-10 V	PARALLEL, WORD	0 Cel		SAMPLE	QUAD	15 us	S-PQCC-J28	1	4.57 mm	11.505 mm					11.505 mm
MXB7846EEE-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	16	SSOP	RECTANGULAR	PLASTIC/EPOXY	2	YES	2.5 V	.125 MHz	1	BICMOS		12		.0488 %	2.7 V	BINARY			SMALL OUTLINE, SHRINK PITCH			.635 mm	85 Cel	0 V	SERIAL	-40 Cel	TIN LEAD	TRACK	DUAL	6 us	R-PDSO-G16	1	1.73 mm	3.9 mm	Not Qualified	e0		245	4.89 mm
MX7572SQ05	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	24	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5 V		1	CMOS	MIL-STD-883	12	12 mA	.024 %	5 V	OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5,-15	-15 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	125 Cel	0 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL	5200000 us	R-GDIP-T24	1	5.08 mm	7.62 mm	Not Qualified	e0
MX674AJEWI+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	10 V		1	BICMOS		12		.0244 %	15 V	BINARY, OFFSET BINARY		-15 V	SMALL OUTLINE			1.27 mm	85 Cel	-10 V	PARALLEL, WORD	-40 Cel	MATTE TIN	SAMPLE	DUAL	15 us	R-PDSO-G28	1	2.65 mm	7.5 mm	Not Qualified	e3			17.9 mm
MX7581UQ	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	8	NO	5 V		1	CMOS		8		.1953 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY BINARY	5		IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	125 Cel	-5 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD		DUAL		R-GDIP-T28	1	5.89 mm	15.24 mm	Not Qualified	e0
MX7574SQ/HR	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	18	DIP	RECTANGULAR	CERAMIC	1	NO	10 V		1	CMOS	MIL-STD-883 Class B (Modified)	8		.3 %	5 V	OFFSET BINARY	5		IN-LINE	DIP18,.3	Analog to Digital Converters	2.54 mm	125 Cel			-55 Cel	Tin/Lead (Sn/Pb)		DUAL		R-XDIP-T18				Not Qualified	e0
MX7820BQ	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL EXTENDED	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5.1 V		1	CMOS		8			5 V	BINARY	5		IN-LINE	DIP20,.3	Analog to Digital Converters	2.54 mm	85 Cel	-.1 V	PARALLEL, 8 BITS	-25 Cel	TIN LEAD	TRACK	DUAL	2 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			24.13 mm
MX7672LN10-T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	2	NO	5 V		1	BICMOS		12		.0122 %	5 V	BINARY		-12 V	IN-LINE			2.54 mm	70 Cel	-5 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL	10.4 us	R-PDIP-T24		5.08 mm	15.24 mm	Not Qualified	e0			31.75 mm
MX7820UQ	Maxim Integrated	ADC, FLASH METHOD	MILITARY	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	5.1 V		1	CMOS		8			5 V	BINARY	5		IN-LINE	DIP20,.3	Analog to Digital Converters	2.54 mm	125 Cel	-.1 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD	TRACK	DUAL	2.5 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			24.13 mm
MX7821BQ	Maxim Integrated	ADC, FLASH METHOD	INDUSTRIAL	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	2.5 V		1	CMOS		8			5 V	BINARY	5,GND/-5	-5 V	IN-LINE	DIP20,.3	Analog to Digital Converters	2.54 mm	85 Cel	-2.5 V	PARALLEL, 8 BITS	-40 Cel	TIN LEAD	TRACK	DUAL	.4 us	R-GDIP-T20	1	5.08 mm	7.62 mm	Not Qualified	e0			26.16 mm
MX7821KR	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.5 V		1	CMOS		8			5 V	BINARY	5,GND/-5	-5 V	SMALL OUTLINE	SOP20,.4	Analog to Digital Converters	1.27 mm	70 Cel	-2.5 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	.875 us	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0		245	12.8 mm
AD7581JC/D	Maxim Integrated		COMMERCIAL						8		15 V			CMOS		8		.73 %	5 V	BINARY, OFFSET BINARY	5			DIE OR CHIP	Analog to Digital Converters		70 Cel			0 Cel									Not Qualified
MX7575KP+T	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	J BEND	20	QCCJ	SQUARE	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY	5		CHIP CARRIER	LDCC20,.4SQ	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	QUAD	15 us	S-PQCC-J20	1	4.57 mm	8.965 mm	Not Qualified	e3			8.965 mm
MX7828UQ	Maxim Integrated	ADC, FLASH METHOD	MILITARY	THROUGH-HOLE	28	DIP		CERAMIC, GLASS-SEALED	8	NO	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY			IN-LINE	DIP28(UNSPEC)			125 Cel	0 V	PARALLEL, 8 BITS	-55 Cel	TIN LEAD	TRACK	DUAL	2.8 us		1			Not Qualified	e0
MX7672LN10	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	THROUGH-HOLE	24	DIP	RECTANGULAR	PLASTIC/EPOXY	2	NO	5 V		1	BICMOS		12		.0122 %	5 V	BINARY	5,-12	-12 V	IN-LINE	DIP24,.3	Analog to Digital Converters	2.54 mm	70 Cel	-5 V	PARALLEL, WORD	0 Cel	TIN LEAD		DUAL	10.4 us	R-PDIP-T24	1	5.08 mm	15.24 mm	Not Qualified	e0			31.75 mm
MX7820LCWP	Maxim Integrated	ADC, FLASH METHOD	COMMERCIAL	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	5.1 V		1	CMOS		8			5 V	BINARY	5		SMALL OUTLINE	SOP20,.4	Analog to Digital Converters	1.27 mm	70 Cel	-.1 V	PARALLEL, 8 BITS	0 Cel	TIN LEAD	TRACK	DUAL	2 us	R-PDSO-G20	1	2.65 mm	7.5 mm	Not Qualified	e0			12.8 mm
MX7574SD	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	18	DIP	RECTANGULAR	UNSPECIFIED	1	NO	10 V		1	CMOS		8		.3 %	5 V	BINARY, OFFSET BINARY, COMPLEMENTARY OFFSET BINARY	5		IN-LINE	DIP18,.3	Analog to Digital Converters	2.54 mm	125 Cel	-10 V	PARALLEL, 8 BITS	-55 Cel	GOLD OVER NICKEL		DUAL		R-XDIP-T18	1	5.72 mm	7.62 mm	Not Qualified	e4
MX7582BQ	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	4	NO	5 V		1			12			15 V	BINARY		-5 V	IN-LINE			2.54 mm	85 Cel	0 V	PARALLEL, WORD	-40 Cel	TIN LEAD		DUAL		R-GDIP-T28		5.89 mm	15.24 mm	Not Qualified	e0
MX7824BQ	Maxim Integrated	ADC, FLASH METHOD	INDUSTRIAL	THROUGH-HOLE	24	DIP		CERAMIC, GLASS-SEALED	4	NO	5.25 V		1	CMOS		8			5 V	COMPLEMENTARY OFFSET BINARY			IN-LINE	DIP24(UNSPEC)			85 Cel	0 V	PARALLEL, 8 BITS	-40 Cel	Tin/Lead (Sn/Pb)	TRACK	DUAL	2.4 us		1			Not Qualified	e0
MX674ALEPI	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	1	NO	10 V		1	BICMOS		12		.0122 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	85 Cel	-10 V	PARALLEL, WORD	-40 Cel	TIN LEAD	SAMPLE	DUAL	15 us	R-PDIP-T28	1	5.08 mm	15.24 mm	Not Qualified	e0			36.83 mm
DS2450S	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	4	YES	5.1199 V		1	CMOS		16			5 V	BINARY	5		SMALL OUTLINE	SOP8,.3	Analog to Digital Converters	1.27 mm	85 Cel	2.56 V	SERIAL	-40 Cel	TIN LEAD	SAMPLE	DUAL		R-PDSO-G8		2.13 mm	5.285 mm	Not Qualified	e0	20	240	5.31 mm
MAX674ATD	Maxim Integrated
MX674ATQ	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	MILITARY	THROUGH-HOLE	28	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	1	NO	10 V		1	BICMOS		12		.0183 %	15 V	BINARY, OFFSET BINARY	5,+-12/+-15	-15 V	IN-LINE	DIP28,.6	Analog to Digital Converters	2.54 mm	125 Cel	-10 V	PARALLEL, WORD	-55 Cel	TIN LEAD	SAMPLE	DUAL	15 us	R-GDIP-T28	1	5.89 mm	15.24 mm	Not Qualified	e0
MX7575KCWN+	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	COMMERCIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.3906 %	5 V	OFFSET BINARY	5		SMALL OUTLINE	SOP18,.4	Analog to Digital Converters	1.27 mm	70 Cel	0 V	PARALLEL, 8 BITS	0 Cel	MATTE TIN	TRACK	DUAL	15 us	R-PDSO-G18	1	2.65 mm	7.5 mm	Not Qualified	e3	30	260	11.55 mm
MX7575KEWN	Maxim Integrated	ADC, SUCCESSIVE APPROXIMATION	INDUSTRIAL	GULL WING	18	SOP	RECTANGULAR	PLASTIC/EPOXY	1	YES	2.46 V		1	CMOS		8		.1953 %	5 V	OFFSET BINARY			SMALL OUTLINE				85 Cel	0 V	SERIAL	-40 Cel	Tin/Lead (Sn/Pb)	TRACK	DUAL	15 us	R-PDSO-G18	1			Not Qualified	e0

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.